WebUpwards (Z-axis) A pull test is the most common test to perform on a bond tester. It is performed by applying an upward force under gold, aluminum or copper wires or ribbons and effectively pulling it away from the substrate moving the Z-stage until the bond breaks (destructive) or a pre-defined force is reached (non-destructive). WebRoyce bond testing systems can handle a variety of testing applications including wire bond pull testing, wire bond ball shear testing, BGA ball shear testing, die shear testing, and high speed ball shear testing. …
MIL-STD-883E BOND STRENGTH (DESTRUCTIVE BOND PULL …
WebOur refined process capability combined with advanced material application enable us to produce the finest wire pull (hook) for precision, accuracy and durability. Our precision micro machined tips are specially designed for … WebOct 10, 2011 · The most common bond test is the wire pull test. In this test, a wire is pulled upward (perpendicular to the substrate) by a hook until there is a failure (either a bond failure or the wire breaks). Wire pull … dogfish tackle \u0026 marine
Wire Pull (Hooks) – LDT Micro Precision Co., Ltd.
WebImmediately an in-process non-destructive bond pull test was instituted to alert us to any discrepancies during the manufacturing cycle itself on a daily basis. In addition, Auger analysis was completed to determine the nature and extent of the contamination on the bond pads. A destructive pull test on a sample of the parts WebApplications. Semiconductor Defect Analysis & Characterisation, Wire Bond Testing, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Materials Testing, Die Shear & … Web1. For wire diameters not specified, use the curve of Figure 1 to determine the bond pull limit. 2. For ribbon wire, use the equivalent round wire diameter width which gives the … dog face on pajama bottoms